KoSiF - complex systems in foil
Electronic products are traditionally made of mechanical inflexible components, i. e. relatively thick silicon chips and a rigid packaging. Many applications, however, require small and flexible systems at a low headroom.
Even highly-complex silicon chips can nowadays be manufactured to be very thin, i. e. a few micrometers, and be embedded into thin plastics foils. Antennas, accumulators and batteries are printed directly onto foil these days. Advancements in organic electronics also allow for the production of electronic circuits on foil using printing processes.
The KoSiF (Komplexe Systeme in Folie) research project research, evaluates and technologically adjusts the necessary technologies for additional functionalities that will be required for the manufacture of future thin and flexible products. KoSiF represents an initiative made up of industry, research facilities and universities aiming to find means of integration of thin silicon chips, thin-film components and organic electronics on one foil substrate enabling autonomous and intelligent flexible electronics.
The project will realize two demonstrator, i. e. Smart Skin and Smart Switch, which will be connected to similar key technologies.
Functionalities created from such a technology can be categorized in additional applications as Smart Label, Smart Network Node and Smart Sensor and will initiate further developments in such developmental areas.